发明名称 |
THERMOSETTING COMPOSITION FOR SOLDER RESIST AND CURED PRODUCT THEREOF |
摘要 |
There is provided a novel thermosetting composition for a solder resist with excellent flexibility, low warping upon curing, soldering heat resistance, PCT resistance and HHBT resistance, which is suitable as a thermosetting solder resist ink for printed circuit boards and particularly FPC boards. The thermosetting composition for a solder resist according to the invention comprises as essential components: (A) an epoxy resin having two or more epoxy groups in the molecule, (B) a polyacid anhydride represented by general formula (I) as defined in claims, wherein R represents a divalent organic group and n represents an integer of 2-30, and (C) a coupling agent. |
申请公布号 |
WO2006088230(A1) |
申请公布日期 |
2006.08.24 |
申请号 |
WO2006JP303210 |
申请日期 |
2006.02.16 |
申请人 |
SHOWA DENKO K.K.;MIYAJIMA, YOSHIO;WADA, TETSUO;NAKAMURA, AYAKO |
发明人 |
MIYAJIMA, YOSHIO;WADA, TETSUO;NAKAMURA, AYAKO |
分类号 |
C08G59/42;C08G59/20;C08L63/00;H01L23/00 |
主分类号 |
C08G59/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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