Herstellungsverfahren einer elektrischen leitenden Paste für Vias und Herstellungsverfahren eines monolitischen Keramiksubstrates damit

摘要

As an electrically conductive paste for via-holes, an organic vehicle and an electrically conductive metal powder 1 coated with an insoluble resin 2 which is insoluble in the organic vehicle are prepared. Filling via-holes with the electrically conductive paste for via-holes produces a monolithic ceramic. Filling characteristics of the electrically conductive paste into via-holes are improved, and cracks and elevations of the conductive metal and cracks of the ceramic barely form during the baking step. Further, the resulting monolithic ceramic substrate can maintain excellent soldering wettability and plating characteristics.