| 发明名称 |
POLISHING APPARATUS AND RELATED POLISHING METHODS |
| 摘要 |
Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.
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| 申请公布号 |
US2006189259(A1) |
申请公布日期 |
2006.08.24 |
| 申请号 |
US20060381415 |
申请日期 |
2006.05.03 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK MOO-YONG;HAH SANG-ROK;KIM JONG-GYOON;SON HONG-SEONG;HAN JA-HYUNG |
| 分类号 |
B24B51/00;B24B1/00;B24B37/005;B24B37/30;B24B49/16;H01L21/304 |
主分类号 |
B24B51/00 |
| 代理机构 |
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