USE OF PHOSPHORESCENT MATERIALS FOR TWO-DIMENSIONAL WAFER MAPPING IN A CHEMICAL MECHANICAL POLISHING

摘要

Systems and methods for the determination of the end point in a chemical mechanical polishing process are described. The method involves the use of a luminescent indicator that is selectively affected by a material released from a substrate being polished. The luminescence of the indicator is monitored across the substrate surface to assess the content of the surface in determining the desired polishing end point.