| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC label which is not thick needlessly and has enough adhesive force not to be easily peeled off when attached to a product. <P>SOLUTION: For the IC label L1 formed in such a way that an inlet 3 mounted with an IC 5 is sandwiched between a pair of sheets 1 and 2 and the sheets are bonded, while adhesives 8 and 9 moves to the sheet 1 together with the inlet 3 when the one sheet 1 is peeled off from the other sheet 2. The adhesives 8 and 9 are applied to the pair of sheet 1 and 2 respectively, and the inlet 3 is sandwiched between these adhesives. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
