| 摘要 |
PROBLEM TO BE SOLVED: To make the positioning of a semiconductor laser device easily and in a short time at the time of incorporating it into, for example, an optical pickup, in the case that the semiconductor laser device is used by being incorporated into the optical pickup. SOLUTION: The semiconductor laser device 10 comprises a semiconductor chip 13 which emits laser light, a lead frame 11 to mount the semiconductor chip 13 on, and a cover 14 which is installed on the mounting surface side of the semiconductor chip 13 in the lead frame 11 and so set up as to cover the semiconductor chip 13. A cutout 14a is so formed in the cover 14 that the end face C of the semiconductor chip 13 on the laser light emission side may be located outside from the edge B of the cover 14 on the laser light emission side. COPYRIGHT: (C)2006,JPO&NCIPI
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