CURABLE RESIN COMPOSITION, PREPREG, SUBSTRATE, METAL FOIL-CLAD LAMINATED PLATE, METAL FOIL WITH RESIN, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a printed wiring board exhibiting sufficiently excellent adhesion between wirings and a substrate and a prepreg sufficiently suppressed in breakage or cracks. SOLUTION: The curable resin composition for a printed wiring board comprises a component (a): an acrylic polymer having a monomer unit derived from glycidyl (meth)acrylate, a component (b): an epoxy resin, a component (c): a phenolic resin, a component (d): a curing accelerator, and a component (e): urea and/or a derivative thereof. COPYRIGHT: (C)2006,JPO&NCIPI