Electronic component with stacked semiconductor chips and method for producing the same

摘要

A semiconductor component includes a first module component and a second module component stacked one on top of the other, and a spacer arranged between the two module components. The module components are electrically connected to one another and/or to a higher-level circuit carrier by connecting elements. At at least one point, the spacing between the spacer and a contact area of the lower of the two module components is kept very small or the spacer overlaps and partially covers the contact area.