发明名称 |
Resin sealing method for electronic part and mold used for the method |
摘要 |
An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lower mold. A cavity side surface is also covered with the release film. Therefore, releasability of a cured resin from the cavity side surface is increased. As a result, the cured resin is prevented from being damaged near the cavity side surface.
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申请公布号 |
US2006186576(A1) |
申请公布日期 |
2006.08.24 |
申请号 |
US20050562356 |
申请日期 |
2005.12.27 |
申请人 |
TAKASE SHINJI;TAMURA TAKASHI;ONISHI YOHEI |
发明人 |
TAKASE SHINJI;TAMURA TAKASHI;ONISHI YOHEI |
分类号 |
B29C33/12;B29C45/14;B29C33/68;B29C43/18;B29C43/36;B29C43/38;B29L31/34;H01L21/56;H01L23/31 |
主分类号 |
B29C33/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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