| 摘要 |
A land grid array package has a construction in which a device-side ground electrode 6 and a substrate-side ground electrode 9, as well as device-side peripheral electrodes 7 and substrate-side peripheral electrodes 10 are soldered by eutectic solder 16. The land grid array package is characterized in that one or more gas-vent through holes 15 passing through a package substrate 3 are formed within a soldering region 18 of the device-side ground electrode 6. Thus, a land grid array package that can prevent short circuits or disconnections is provided.
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