发明名称 Temperature compensation for silicon MEMS resonator
摘要 Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.
申请公布号 US2006186971(A1) 申请公布日期 2006.08.24
申请号 US20060405817 申请日期 2006.04.18
申请人 发明人 LUTZ MARKUS;PARTRIDGE AARON
分类号 H03H9/00 主分类号 H03H9/00
代理机构 代理人
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