<p>A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183 0C (about 361°F).</p>
申请公布号
WO2006087648(A1)
申请公布日期
2006.08.24
申请号
WO2006IB50372
申请日期
2006.02.04
申请人
ILLINOIS TOOL WORKS INC.;KLEIN, GARY J.;MAX, SUSAN D.
