SINGLE OR MULTI-LAYER PRINTED CIRCUIT BOARD WITH IMPROVED VIA DESIGN
摘要
A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.
申请公布号
WO2006053206(A9)
申请公布日期
2006.08.24
申请号
WO2005US40907
申请日期
2005.11.10
申请人
PPG INDUSTRIES OHIO, INC.
发明人
OLSON, KEVIN, C.;WANG, ALAN, E.;ELENIUS, PETER;GOODMAN, THOMAS, W.