| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an art which is universal and simply practicable, while assuring the reliability as a semiconductor device, by controlling the distance and the parallelism between a semiconductor device and a mounting substrate with a high degree of accuracy, in a flip-chip mounting method. <P>SOLUTION: A spacer is provided with the same height as a projection electrode on a semiconductor device other than salient electrodes or the whole surface of the circuit of the mounting substrate, and has insulation and thermal resistance which define the distance and the parallelism between the semiconductor device and the mounting substrate. Furthermore, flip-chip mounting is performed, before jointing the semiconductor device and the mounting substrate via the projection electrode, after applying a material used as the liquid spacer to the semiconductor device or the mounting substrate and hardening. In addition, a buffer material is provided between a flip-chip mounting machine and the semiconductor device or the mounting substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
