| 摘要 |
A method for accurately positioning and aligning multiple components, such as optical components, on a common substrate. A separate pattern of solder bumps is formed on the substrate for each of the components to be mounted. Congruent patterns of solder pads are formed on the respective components. The components are placed and positioned on the substrate as accurately as possible using manual or other means, and then the assembly is heated sufficiently to reflow the solder bumps beneath each component. During reflow, the solder pads on the components move into accurate alignment with the solder bumps on the substrate. On cooling, the components are attached and remain in the automatically aligned configuration. |
