| 摘要 |
A method for completing an assembled semiconductor device, which has metallic leads for connection to external parts. The method comprises the step ( 202 ) of encapsulating the assembled device with a polymeric precursor so that at least portions of the leads remain un-encapsulated. Without significant delay, these un-encapsulated lead portions are plated ( 203 ) with at least one metal layer suitable for connection to external parts; the plating step has no noticeable impact on the uncured mold compound. The encapsulated and plated device is then submitted ( 204 ) to a sequence of elevated temperatures for specified periods of time so that concurrently the precursor is polymerized and the at least one metal layer is annealed. |
