| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of certain structure capable of preventing disconnection when a wiring board mounted with a semiconductor chip is sealed up with resin using a sealing mold. <P>SOLUTION: The semiconductor device has a configuration wherein the semiconductor chip 1 is mounted on a printed wiring board 2 and electrically connected to Cu wiring 3 formed on the wiring board 2, and the required area of the wiring board 2 where the semiconductor chip 1 is located is sealed up with a sealing resin 5. A wide part 3a which is as thick as the Cu wiring 3 and long enough in dimension to extend inside and outside the required area is provided to the Cu wiring 3 so as to surround the required area along its boundary. When the printed wiring board 2 is sealed up with resin while being pinched by a sealing mold, pressure applied by the sealing mold is received by the wide part 3a, so that pressure applied on per unit area of the total Cu wiring 3 becomes lower than usual, and the Cu wiring 3 is increased in cross-sectional area and improved in shearing stress-proofness. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
