发明名称 |
Method of forming an implantable electronic device chip level hermetic and biocompatible electronics package using SOI wafers |
摘要 |
The invention is directed to a hermetically packaged and implantable integrated circuit for electronics that is made my producing streets in silicon-on-insulator chips that are subsequently coated with a selected electrically insulating thin film prior to completing the dicing process to yield an individual chip. A thin-layered circuit may transmit light, allowing a photodetector to respond to transmitted light to stimulate a retina, for example. Discrete electronic components may be placed in the three-dimensional street area of the integrated circuit package, yielding a completely integrated hermetic package that is implantable in living tissue.
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申请公布号 |
US2006186473(A1) |
申请公布日期 |
2006.08.24 |
申请号 |
US20060406743 |
申请日期 |
2006.04.18 |
申请人 |
SECOND SIGHT MEDICAL PRODUCTS, INC. |
发明人 |
MECH BRIAN V.;GREENBERG ROBERT J.;DELMAIN GREGORY J. |
分类号 |
H01L27/12;H01L21/762;H01L21/84;H01L27/01 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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