发明名称 Method of manufacturing capacitor of semiconductor device
摘要 Provided is a method of manufacturing a capacitor of a semiconductor device, which can prevent tilting or an electrical short of a lower electrode. In the method, a mesh-type bridge insulating layer is formed above the contact plug on a mold oxide layer. The mold oxide layer and the bridge insulating layer are etched to define an electrode region. The mold oxide layer is removed using an etching gas having an etch selectivity of 500 or greater for the mold oxide layer with respect to the bridge insulating layer.
申请公布号 US2006189064(A1) 申请公布日期 2006.08.24
申请号 US20060329577 申请日期 2006.01.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIM WOO-GWAN;OH JUNG-MIN;HONG CHANG-KI;CHOI SANG-JUN;KIM SANG-YONG
分类号 H01L21/8238 主分类号 H01L21/8238
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