| 摘要 |
A memory assembly has a memory package with a plurality of interconnect pins having a plurality of first power input pins located on a first side of the memory package, the first power input pins independent of each other. A lead-over-chip leadframe has a plurality of leads coupled to the plurality of interconnect pins in a one-to-one relationship. A memory chip is coupled to the plurality of leads and has substrate with a memory device fabricated thereon and a plurality of first power input chip bond pads fabricated thereon and coupled to the memory device. Each first power input chip bond pad is further coupled to one of the first power input pins through one of the leads. |
