| 发明名称 |
EQUIPMENT AND METHOD FOR MOUNTING COMPONENT |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide equipment for mounting a component in which the vicinity of the working region of a substrate is supported surely on a substrate stage and the substrate is held surely with high planarity for the substrate stage. <P>SOLUTION: The substrate stage 21B of component mounting equipment comprises a rigid portion 71 for mounting the lower surface side at the supporting part of a substrate in the vicinity of the mounting region and having a hole 73A for sucking the lower surface side of the substrate, and a flexible suction pad 31B for mounting the lower surface side at other supporting part of the substrate and sucking the lower surface side of the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2006222286(A) |
申请公布日期 |
2006.08.24 |
| 申请号 |
JP20050034544 |
申请日期 |
2005.02.10 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TSUJI SHINJIRO;ODAWARA KOZO |
| 分类号 |
H01L21/60;G02F1/13;H01L21/683;H05K13/04 |
主分类号 |
H01L21/60 |
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