发明名称 WIRING CIRCUIT BOARD AND ITS PRODUCTION PROCESS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring circuit board in which high productivity and cost reduction can be ensured while enhancing connection reliability of a terminal portion and an external terminal, and to provide its production process. <P>SOLUTION: After a conductor pattern 3 including a terminal portion 6 for connection with the external terminal 22 of an electronic component 21, and a mark 8 for judging presence of a portion impeding connection of the terminal portion 6 and the external terminal 22 caused by formation of a cover insulation layer 4 are formed simultaneously on a base insulation layer 2, the cover insulation layer 4 is formed to cover the conductor pattern 3 while having an opening 7 for exposing the terminal portion 6 and the judgment mark 8. Thereafter, presence of an impeding portion is judged with reference to the judgment mark 8 exposed from the opening 7 of the cover insulation layer 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006222218(A) 申请公布日期 2006.08.24
申请号 JP20050033327 申请日期 2005.02.09
申请人 NITTO DENKO CORP 发明人 TAKAYOSHI YUICHI;ICHIKAWA KAZUYUKI;NAITO TOSHIKI
分类号 H05K1/02;H05K3/00;H05K3/28 主分类号 H05K1/02
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