发明名称 CUTTING METHOD OF SINGLE CRYSTAL INGOT
摘要 <p><P>PROBLEM TO BE SOLVED: To cut a single crystal ingot relatively accurately while keeping the smoothness thereof and to enhance the life of a blade used in cutting. <P>SOLUTION: In the cutting method of the single crystal ingot, the single crystal ingot 10a is arranged under the linearly moving part 18a of the blade driven around the ingot so as to cross the linear moving direction of the blade at a right angle to be cut by the linearly moving part of the blade. The displacement quantity A in the axial direction of the uppermost end and lowermost end of the cut surface 10b of the ingot after the cutting of the ingot is detected and the inclination of the linearly moving part of the blade is corrected so that an imaginary cut surface 10c including the linearly moving part of the blade is inclined in the direction reverse to the cut surface of the ingot and the displacement quantity B in the axial direction of the ingot of the uppermost and lowermost ends of the ingot crossing the imaginary cut surface becomes same to the displacement quantity A in the axial direction of the ingot of the uppermost and lowermost ends of the cut surface of the ingot. The cutting of the ingot is further performed by the linear moving part corrected in its inclination of the blade. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006218652(A) 申请公布日期 2006.08.24
申请号 JP20050032040 申请日期 2005.02.08
申请人 SUMCO CORP 发明人 YAMAZAKI MASAHIKO;DAITO YOSHITSUGU
分类号 B28D5/04;H01L21/304 主分类号 B28D5/04
代理机构 代理人
主权项
地址