发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a low-loss power semiconductor device having a super junction easy in manufacturing and suitable for high volume production. SOLUTION: A method of manufacturing a semiconductor device forms a first conduction-type region and a second conduction-type region in a semiconductor by selectively irradiating an impurity ion into the semiconductor. The regions are alternately disposed with respect to a wafer surface. The first and second conduction-type regions are alternately disposed such that junctions are formed, an area of an irradiation region of the impurity ion is controlled by the electric or magnetic scan of the impurity ion, and the control of accelerating energy of the impurity ion and the area of the irradiation region is performed in a way of decreasing the area of the irradiation region in accordance with an increase in the accelerating energy so that section profiles and the section area of the first and second conduction types are constant along a irradiation direction. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006222444(A) 申请公布日期 2006.08.24
申请号 JP20060086192 申请日期 2006.03.27
申请人 TOSHIBA CORP 发明人 TAKEDA TORU;TSUNODA TETSUJIRO
分类号 H01L21/266;H01L21/265;H01L21/336;H01L29/78 主分类号 H01L21/266
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