| 摘要 |
PROBLEM TO BE SOLVED: To provide equipment and a method for producing a semiconductor where impurities adhering to the inside of the equipment can be removed easily. SOLUTION: The equipment 1 for producing a semiconductor comprises a vacuum processing chamber 4 or 6, having a mechanism for charging a semiconductor wafer and depositing a film on the semiconductor wafer, a vacuum conveyance chamber 3 for conveying the semiconductor wafer, a means of generating negative ions, and a means of supplying negative ions generated from the ion-generating means to the vacuum processing chamber. In the vacuum processing chamber supplied with negative ions, the negative ions are made to react with particles inside the vacuum processing chamber, and the semiconductor wafer is charged negative by the charging mechanism so that ionized particles do not adhere thereto, thus removing the particles in the vacuum processing chamber. COPYRIGHT: (C)2006,JPO&NCIPI
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