发明名称 HEAT DISSIPATION DEVICE AND HEAT DISSIPATION METHOD OF ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a practical device and a method for dissipating the heat of an electronic apparatus in which a sufficient heat dissipation effect can be attained by a simple arrangement. SOLUTION: The device for dissipating the heat of an electronic apparatus comprises a shield case 35 covering the surface of a circuit board 31 including a circuit component 32 and having a flat surface board 35a substantially parallel with the surface of the circuit board 31 with fixed plates 35f and 35g projecting toward the circuit board 31 from a position on the flat surface board 35a corresponding to the circuit component 32, and a heat sink 34 touching a heat conduction sheet 33 adhering to the circuit component 32 when the surface of the circuit board 31 is covered with the shield case 35 fixed to the fixed plates 35f and 35g of the shield case 35. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006222146(A) 申请公布日期 2006.08.24
申请号 JP20050031953 申请日期 2005.02.08
申请人 TOSHIBA CORP 发明人 KAMEMOTO KAZUHIRO;TSURUFUSA HIDEO;NUMATA TAKEHIKO
分类号 H05K7/20;H01L23/36;H05K9/00 主分类号 H05K7/20
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