发明名称 |
Slurry composition, method of polishing an object and method of forming a contact in a semiconductor device using the slurry composition |
摘要 |
In a slurry composition preventing damage to an insulation layer, and uniformly polishing a metal layer, the slurry composition includes an acidic aqueous solution having a first pH and an anionic surfactant having a second pH lower than or equal to the first pH. Irregular polishing of the metal layer relative to a pattern density may be prevented and a contact having a uniform thickness may be formed using the slurry composition.
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申请公布号 |
US2006189152(A1) |
申请公布日期 |
2006.08.24 |
申请号 |
US20050323356 |
申请日期 |
2005.12.29 |
申请人 |
JANG KI-HOON;KO YONG-SUN;KIM KYUNG-HYUN |
发明人 |
JANG KI-HOON;KO YONG-SUN;KIM KYUNG-HYUN |
分类号 |
H01L21/00;H01L21/31 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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