TEMPERATURE SETTING METHOD FOR HEAT TREATING PLATE, TEMPERATURE SETTING DEVICE FOR HEAT TREATING PLATE, PROGRAM AND COMPUTER-READABLE RECORDING MEDIUM RECORDING PROGRAM

摘要

A hot plate temperature is set so as to form the line width of a resist pattern uniformly in a wafer plane. The hot plate of a PEB device is divided into a plurality of hot plate regions, with temperature setting being possible for each hot plate region. A temperature correction value for regulating the in-plane temperature of a wafer to be mounted on the hot plate is set for each hot plate region of the hot plate. The temperature correction value of each hot plate region of the hot plate is set based on a temperature correction table indicating an optimum temperature correction value corresponding to each warpage quantity and warpage shape of a wafer to be heat treated. The temperature correction table defines, for each warpage quantity and warpage shape of a wafer, an optimum temperature correction value that makes uniform a line width to be finally formed in a wafer plane.