Micro heat transfer device for cooling electronic components has channels open at top and bottom, and closed towards side surfaces

摘要

The micro heat transfer device has a microstructure consisting of channels (2) fitted in at least one plate-type matrix element (1), with at least one heat-carrying medium flowing through it. The channels are opened towards the top (5) and/or the bottom (6). They are closed towards the side surfaces (3, 4).