| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition having non of or an extremely small amount of a material that transfers to a silicon wafer when a cured product of the composition is contacted with the wafer. SOLUTION: The composition comprises (A) a 100 pts.mass straight chain fluoro polyether compound having at least two alkenyl groups in one molecule, (B) a fluorine-containing organohydrogensiloxane having at least two SiH bonds in one molecule in such an amount that the amount of the SiH bond relative to one mol of an alkenyl group of the component (A) is 0.5-3.0 mol, (C) a platinum group compound of 0.1-500 ppm in terms of the platinum group metal atom, and (D) a 1-50 pts.mass dry silica having at least 350×10<SP>18</SP>pieces/g silanol group on its surface. COPYRIGHT: (C)2006,JPO&NCIPI
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