| 摘要 |
A wire bonder and a method of bonding a bonding wire to a bonding pad of a bonding location using the wire bonder are provided. The method includes forming a bonding ball at an end of the bonding wire, pre-deforming at least a portion of the bonding ball and bonding the pre-deformed ball to the bonding pad. The wire bonder includes a source of heat disposed adjacent a bonding tool to melt a portion of the bonding wire to produce the bonding ball at an end thereof, and a pre-deforming unit including a deforming surface to pre-deform at least a portion of the bonding ball.
|
