| 摘要 |
A display device that efficiently dissipates high temperature heat generated from a driver IC of a driver IC package. The display device includes a display panel, a chassis base having the display panel on a first surface, the printed circuit board assembly mounted at a second surface of the chassis base the second surface being opposite to the first surface, and a driver IC package having a driver IC connected to an electrode of the display device and the printed circuit board assembly. Additionally, the display device may include a thermal conduction sheet inserted between the display device and the chassis base and having an extension portion formed at a position corresponding to the driver IC, and a thermal conduction member formed between the extension portion of the thermal conduction sheet and the chassis base.
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