发明名称 Method of forming a coated film, method of forming an electronic device, and method of manufacturing an electron emission element
摘要 A slit forming process with respect to a coated film, includes: forming a step pattern having an end part on a substrate; coating a liquid material for forming a coated film on the substrate in the manner of covering at least the end part of the step pattern; and forming the coated film by drying the coated liquid material, together with forming a slit at a position corresponding to the end part of the step pattern.
申请公布号 US2006188648(A1) 申请公布日期 2006.08.24
申请号 US20060322231 申请日期 2006.01.03
申请人 SEIKO EPSON CORPORATION 发明人 YUDASAKA ICHIO
分类号 B05D5/12 主分类号 B05D5/12
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