发明名称 |
HIGH ASPECT RATIO PLATED THROUGH HOLES IN A PRINTED CIRCUIT BOARD |
摘要 |
<p>The drilling and plating of high aspect ratio blind via holes in a multilayer printed circuit board are disclosed. A via hole is drilled through a sub-composite structure. The walls of the via hole are plated with a conductive material, and the hole is filled with a conductive medium. The sub-composite structure proceeds through the remainder of the processing that is necessary to manufacture the printed circuit board up to the completion of the solder mask step. The conductive medium of the via hole is drilled out to achieve a hole size that is of the desired diameter as required by the printed circuit board design.</p> |
申请公布号 |
WO2006089255(A2) |
申请公布日期 |
2006.08.24 |
申请号 |
WO2006US05892 |
申请日期 |
2006.02.16 |
申请人 |
SANMINA-SCI CORPORATION |
发明人 |
KNIGHT, SUZANNE;THOMAS, DOUGLAS |
分类号 |
H05K1/11;H01K3/10 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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