THERMOSETTING ONE-COMPONENT RESIN COMPOSITION

摘要

A thermosetting one-component resin composition comprising: (1) a compound, or mixture of compound, containing at least one of a compound having two or more thiirane rings in each molecule thereof (A), a compound having both of a thiirane ring and an oxirane ring in each molecule thereof (B) and a compound having one or more oxirane rings and containing no thiirane ring in each molecule thereof (C), wherein the ratio of oxirane rings/thiirane rings contained is in the range of 40/60 to 10/90; (2) a thiol compound having one or more thiol group in each molecule thereof; and (3) a heat-latent curing accelerator; optionally together with (4) an acid compound and/or a boric acid ester; and (5) core/shell type acrylic rubber microparticles. This composition can be used in various usages, such as bonding, sealing, casting, molding, painting, coating, etc., excelling in low-temperature rapid curability as compared with that of conventional episulfide thermosetting one-component resin composition, and has excellent storage stability.