| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the adhesive property of each chip in a semiconductor device where a plurality of semiconductor chips are laminated on a mounted substrate to improve the reliability of the semiconductor device. <P>SOLUTION: After an adhesive 7 mainly including a thermosetting resin is coated on a semiconductor chip mounting region on the mounted substrate 1 and a semiconductor chip 3A is mounted, the adhesive 7 is cured by performing thermal treatment. If it is naturally cooled down to a normal temperature, the mounted substrate 1 or the like is changed to a warped shape that is convex by a difference in an α value between the mounted substrate 1 and the semiconductor chip 3A. A pad P1 and a pad PA are then wire-bonded, next, an adhesive 9A including a thermosetting resin is affixed onto the semiconductor chip 3A, and a spacer chip 5 is heat crimped over the portion. Thus, the mounted substrate 1 and the semiconductor chip 3A are each almost flattened by the heat at the time of thermal crimping, thereby improving the adhesive property of the semiconductor chip 3A and the chip 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
