| 发明名称 |
BONDING METHOD, AND DEVICE CREATED BY THE METHOD AND BONDING APPARATUS |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding technique for bonding without needing energy wave processing under a high vacuum and bonding under a continued high vacuum. <P>SOLUTION: After forming a bonding part made of metal in a contour-like shape and etching (surface activation processing) the bonding part by plasma, by bonding objects to be bonded each other by pushing and breaking a deposition layer which re-adhered to the bonding part, a space formed by being surrounded in the contour-like shape by the bonding part between bonding surfaces can be sealed into a predetermined atmosphere. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
| 申请公布号 |
JP2006222436(A) |
申请公布日期 |
2006.08.24 |
| 申请号 |
JP20060050248 |
申请日期 |
2006.02.27 |
| 申请人 |
BONDOTEKKU:KK;SUGA TADATOMO |
发明人 |
SUGA TADATOMO;OKADA MASUAKI |
| 分类号 |
H01L21/60;H01L21/02 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
