APPARATUS AND METHOD FOR MOUNTING CHIP

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for picking up a chip stably and mounting it on a substrate. SOLUTION: In the apparatus for picking up a chip from a sheet sticking the chip by an adhesive substance generating gas through irradiation with light and mounting the chip on a substrate, a means for irradiating the sheet with light from the lower surface side in order to reduce adhesion holding force is fixed with a planar light shielding member 9 provided with a light transmitting portion T and a light shielding portion N. Under a state where the light shielding member 9 is aligned with a chip 6 to be picked up, profile and dimensions of the light transmitting portion T are set such that the light transmitting portion T does not project to the outside of an inner edge line 6b set in closed shape while spaced apart by predetermined with d inward from the outline 6a of the chip 6. Consequently, impact of irradiation on an adjacent chip 6 is eliminated and the chip 6 can be picked up stably and mounted on the substrate. COPYRIGHT: (C)2006,JPO&NCIPI