| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure in which heat generated by devices is still more radiated by reducing a heat resistance, and an operation, lifetime or reliability of the devices can be enhanced, and also, a reduction of a cost or a shortening of a process is intended by a decrease of the number of components. SOLUTION: In the heat dissipation structure, a device 10 which generates heat during operation is joined to one surface of a metal foil 15, and the other surface of the metal foil 15 is brought into direct contact with a refrigerant 23 for cooling. The metal foil 15 is joined to a support member 16 with electric insulation. The support member 16 with electric insulation is formed as one bulkhead face of a heat sink 2 including the refrigerant to remove a ceiling 21, or the other surface of the metal foil 15 can be also machined as a fin shape. COPYRIGHT: (C)2006,JPO&NCIPI
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