CONNECTION STRUCTURE AND METHOD OF FORMING SAME, CIRCUIT BOARD, ELECTRONIC COMPONENT SURFACE-MOUNTED ON MOUNTING BOARD, AND METHOD OF FORMING CONNECTION MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a connection structure between circuit boards etc. having a high resistance to thermal stress and a high reliability and also suitable for surface mounting. SOLUTION: The connection structure is one provided between two circuit boards to connect at least one first electrode formed on a major surface of a first board to at least one second electrode formed on a major surface of a second board facing the first electrode. The connection structure is made up of a columnar coupling member integrated with the first board by means of sintering and a solder material surrounding the connection member; and the shape of the cross-section of the connection structure taken along the direction perpendicular to the major surface of at least one of the boards has a progressively increasing diameter toward the first and second electrode starting from the minimum-diameter position in between both of the boards. COPYRIGHT: (C)2006,JPO&NCIPI