| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which can obtain an efficient wafer transfer sequence according to the number of treatment chambers actually used, by minimizing the influence of a wait time during wafer cooling on throughput. SOLUTION: The apparatus comprises a substrate accommodation container for accommodating a plurality of substrates therein; a plurality of processing chambers for treating the substrates; a transfer means for transferring the substrates to the plurality of respective treatment chambers; a selection means for selecting, on the basis of the number of used treatment chambers, one of a plurality of transfer sequences in which the substrate is transferred to at least one of the plurality of treatment chambers from the substrate accommodation container to be subjected to predetermined treatment, and wherein a transfer schedule from the treatment chamber to the substrate accommodation container is prescribed; and a control means for controlling the transfer of the substrates by the transfer means to the respective treatment chambers on the basis of the transfer sequence selected by the selection means. COPYRIGHT: (C)2006,JPO&NCIPI
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