STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER WIRING BOARD INCLUDING THE INTERCONNECT ELEMENT

摘要

An interconnect element (2) is provided which includes a dielectric element (4) having a first major surface, a second major surface remote from the first major surface, and a plurality of recesses extending inwardly from the first major surface. A plurality of metal traces (6), (6a) are embedded in the plurality of recesses, the metal traces having outer surfaces substantially co-planar with the first major surface and inner surfaces remote from the outer surfaces. A plurality of posts (8) extend from the inner surfaces of the plurality of metal traces (6), (6a) through the dielectric element (4), the plurality of posts having tops exposed at the second major surface. A multilayer wiring board (12) including a plurality of such interconnect elements (2) is also provided, as, well as various methods for making such interconnect elements and multilayer wiring boards.