发明名称 |
METAL CONTAINERS FOR SOLDER PASTE |
摘要 |
<p>A container for soldering adjuvant is made of a metal having a composition similar to the composition of a solder bath. Preferably, the container holds solder paste and the container is made of metal having a composition similar to the composition of the metal part of the paste in the container. Exemplary alloys from which the container is made include 2.5 to 5% silver, up to 2% copper and a balance of tin; and a lead-tin eutectic composition.</p> |
申请公布号 |
WO2006089032(A1) |
申请公布日期 |
2006.08.24 |
申请号 |
WO2006US05494 |
申请日期 |
2006.02.15 |
申请人 |
P. KAY METAL, INC.;KAY, LAWRENCE, C. |
发明人 |
KAY, LAWRENCE, C. |
分类号 |
B23K1/005;B23K3/04;B23K35/14 |
主分类号 |
B23K1/005 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|