Mounting structure of semiconductor bare chip

摘要

A semiconductor bare chip (40) includes a plurality of stud bumps (43) provided on the surface of the semiconductor bare chip body (41), each of the stud bumps (43) including a seat (43a) and a head (43b) protruding from the seat (43a). A height (a1) of the head (43b) is less than a thickness (b1) of electrodes (51) on said board (50).