Surface acoustic wave device and method of manufacturing the same, ic card, and mobile electronic apparatus

摘要

A surface acoustic wave device (1) includes a surface acoustic wave (SAW) chip (2) having IDT electrodes (5) disposed on a main surface of a piezoelectric substrate (4), extraction electrodes (8) extracted from the IDT electrodes, and a metal bonding portion (9) disposed along the entire periphery of the main surface of the piezoelectric substrate; and a cover (3) having through-holes (11) disposed on an insulating substrate at positions corresponding to the extraction electrodes of the SAW chip, a metal bonding (13) portion disposed along the entire periphery of a lower surface of the insulating substrate, connection electrodes disposed on the lower surface of the insulating substrate along circumferences of openings of the through-holes, and external electrodes (15) disposed on an upper surface of the insulating substrate in peripheries of openings of the through-holes; wherein the SAW chip and the cover are bonded in a body by bonding the metal bonding portion of the SAW chip and the metal bonding portion of the cover and bonding the extraction electrodes of the SAW chip and the connection electrodes (12) of the cover so as to hermetically seal the IDT electrodes within a space defined between the SAW chip and the cover, and wherein the IDT electrodes and the external electrodes are electrically connected to each other through conductive materials (14) formed in the through-holes.