发明名称 Plating Method
摘要 <p>Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.</p>
申请公布号 EP1693484(A2) 申请公布日期 2006.08.23
申请号 EP20060250733 申请日期 2006.02.10
申请人 ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. 发明人 MONTANO, JOSEPH R.;REESE, JASON A.;LITTLE, LUKE W.
分类号 C23C18/16;C23C18/18;C23C18/28;C25D5/54 主分类号 C23C18/16
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