发明名称 IMPEDANCE-MATCHING COUPLER
摘要 <p>An impedance-matching coupler ( 1 ) comprises a dielectric substrate ( 10 ) onto which a conducting strip ( 12 ) is disposed. A dielectric layer ( 14 ), preferably a dielectric film, is formed on top of the conducting strip and the first dielectric layer to encircle the conducting strip. A metallic layer ( 16, 18 ) is finally provided on top of the dielectric layer. The dielectric layer has a dielectric constant that is substantially higher that the dielectric constant for the dielectric substrate, preferably more than ten times higher. A dielectric film with a thickness of less than 100 mum is advantageous, preferably between 5 and 100 mum, and even more preferably between 10 and 70 mum. The thickness of the dielectric substrate is preferably larger than for the dielectric film, preferably more than ten time larger. The conducting strip has preferably a constant width. The dielectric film thickness is preferably larger than 10% of the conducting strip width.</p>
申请公布号 EP1604424(B1) 申请公布日期 2006.08.23
申请号 EP20030816128 申请日期 2003.03.07
申请人 ERICSSON TELECOMUNICACOES S.A. 发明人 CARVALHO, MARIA;CONRADO, LUIZ;DEMENICIS, LUCIENE;MARGULIS, WALTER;SEIXAS, DANIELE
分类号 H01P5/02;H01P3/08;H01P11/00 主分类号 H01P5/02
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