| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a positive photosensitive insulating resin composition having excellent resolution, electric insulating property and thermal shock resistance and giving a cured product with preferable adhesion property and solvent resistance. <P>SOLUTION: The positive photosensitive insulating resin composition is characterized in that it is provided with an alkali soluble resin (A) having a phenolic hydroxyl group, a compound (B) having a quinone diazide group, crosslinked fine particles (C), a compound (D) having at least two alkyletherified amino groups in the molecule, thermosensitive acid generator (E) and a solvent (F). The cured product characterized in that it is obtained by curing the above positive photosensitive insulating resin composition. <P>COPYRIGHT: (C)2003,JPO |
