LIGHT EMITTING DIODE BASED ILLUMINATION ASSEMBLY

摘要

An illumination assembly includes a substrate having an electrically insulative layer on a first side of the substrate and an electrically conductive layer on a second side of the substrate. A plurality of LED dies is disposed on the substrate. Each LED die is disposed in a via extending through the electrically insulative layer on the first side of the substrate to the electrically conductive layer on the second side of the substrate. Each LED die is operatively connected through the via to the electrically conductive layer.