发明名称 Plasma immersion ion implantation process
摘要 A method of performing plasma immersion ion implantation on a workpiece in a plasma reactor chamber, includes placing the workpiece on a workpiece support in the chamber, controlling a temperature of the wafer support near a constant level, performing plasma immersion ion implantation on the workpiece by introducing an implant species precursor gas into the chamber and generating a plasma while minimizing deposition and minimizing etching by holding the temperature of the workpiece within a temperature range that is above a workpiece deposition threshold temperature and below a workpiece etch threshold temperature.
申请公布号 US7094670(B2) 申请公布日期 2006.08.22
申请号 US20050046661 申请日期 2005.01.28
申请人 APPLIED MATERIALS, INC. 发明人 COLLINS KENNETH S.;HANAWA HIROJI;RAMASWAMY KARTIK;NGUYEN ANDREW;AL-BAYATI AMIR;GALLO BIAGIO
分类号 H01L21/42;H01J37/32;H01L21/205;H01L21/425 主分类号 H01L21/42
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